Nov 10, 2008
TOKYO ELECTRON DEVICE ANNOUNCES
SIMULTANEOUS RELEASE OF THREE HIGH-DENSITY FPGA PCI EXPRESS PLATFORMS
-- Significantly reduce development period of FPGA based High-Speed applications --
Santa Clara, CA., November 10, 2008- Tokyo Electron Device Limited (TED) has today announced the release of three inrevium Virtex®-5 High-Density PCI Express Platforms. These PCI Express Gen 1 & 2 capable platforms utilize Xilinx Virtex-5 LX330T, SX240T and FX200T FPGAs, the highest density FPGAs available.
"In recent years, high performance embedded systems require FPGAs with higher speed, density and performance.” said Yasuo Hatsumi, Director and Xilinx Product Manager, PLD Solution Division of TED. “Further, with shorter product life cycles, customers demand FPGA evaluation platforms that are flexible and meet diversified needs."
The inrevium TB-5V-LX330T/SX240T/FX200T-PCIE-EX is equipped with the highest density Virtex-5 FPGAs with high speed serial I/O and PCI Express Gen 1 and Gen 2 interfaces. Expansion I/O connectors enable a wide variety of interfaces by connecting various optional boards such as DVI, AD/DA, FCRAM. In addition, the large-scale ASIC prototype development can be realized by a cable connecting of multiple FPGA boards.
As future products, TED plans to release a variety of optional boards: 10G and 1Gigabit Ethernet, DDR3 SDRAM, HD-SDI, LVDS, CameraLink, SFP optical module.
The inrevium TB-5V-LX330T/SX240T/FX200T-PCIE-EX includes reference designs to reduce development period of FPGA designs and software designs.
The TB-5V-LX330T/SX240T/FX200T-PCIE-EX features:
●Elpida DDR2-SDRAM component (512Mbit/Data bus 16bit)
●512MB DDR2-SDRAM SO-DIMM (512MBYTE SO-DIMM module is attached)
●Linear Technology Power Solution LTM4601, LTM4616, LTC3026, LTC3413
●SAMTEC Expansion I/O connectors 120pin x3 (Type A)
●SAMTEC RocketIO Expansion I/O connectors (4ch) x4 (Type R)
●Reference designs: PCI Express design with DMA controller of DDR2 SDRAM SO-DIMM
(VerilogHDL),application software (binary)
The inrevium Virtex-5 High-Density PCI Express Platforms target ASIC prototyping, wired and wireless communications, and test and measurement applications, broadcast videos, medical imaging, defense, and high-performance computing applications.
TED will showcase the inrevium Virtex-5 High-Density PCI Express Platforms in Xilinx Booth #F-29 at "Embedded Technology 2008", from November 19 to November 21 at Pacifico Yokohama, Yokohama, Japan.
Pricing and Availability
The inrevium TB-5V-LX330T-PCIE-EX, TB-5V-SX240T-PCIE-EX, TB-5V-FX200T-PCIE-EX will ship in December of 2008 and available through TED's distributions in the world wide. For pricing information, contact at firstname.lastname@example.org or distributors.
About Tokyo Electron Device
Tokyo Electron Device is an affiliate of Tokyo Electron Limited, one of the world’s leading semiconductor manufacturing equipment suppliers. TED has sold its technology as a specialized electronics trading company inside Japan about 40 years, and now the company is applying its knowledge, technology and service capability to establish its inrevium product line in the global industrial market. For more information on inrevium products, visit the website at www.inrevium.jp/eng/.
Tokyo Electron Device, Ltd.
Contact form: https://www.teldevice.co.jp/eng/contact_form_news.html
Tokyo Electron America, Inc.
Contact form: https://www.teldevice.co.jp/inrevium/eng/dl-form.html